S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration

Author:

Lee JiHun,Yong GamHan,Jeong MinSu,Jeon JongHyun,Han DongHoon,Lee MinKeon,Do WonChul,Sohn EunSook,Kelly Mike,Hiner Dave,Khim JinYoung

Publisher

IEEE

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. RDL Embedded Coreless Substrate for Hetelogenious Integlation;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

3. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

4. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

5. Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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