Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging
Author:
Affiliation:
1. R&D, Amkor Technology Korea,Incheon,Korea
2. Advanced Package and Technology Integration, Amkor Technology,Inc.,Tempe,AZ,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195345.pdf?arnumber=10195345
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3. Chiplet meets the real world: benefits and limits of chiplet designs;naffziger;VLSI Symposia Joint Short Course,0
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1. Signal integrity analysis of heterogeneous integration using Si bridge technology;2023 20th International SoC Design Conference (ISOCC);2023-10-25
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