Signal integrity analysis of heterogeneous integration using Si bridge technology
Author:
Affiliation:
1. HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea
Funder
National Research Foundation of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10395912/10395932/10396233.pdf?arnumber=10396233
Reference5 articles.
1. CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
2. Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging
3. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions
4. Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
5. Modeling and analysis of a trace referenced to a meshed ground plane
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