Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
Author:
Affiliation:
1. IBM Research-Tokyo,Shin-Kawasaki,Japan
2. Mitsui Chemicals, Inc.,Nagaura,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816470.pdf?arnumber=9816470
Reference15 articles.
1. 10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
2. Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
3. New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding
4. New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding
5. A Thin Bonding Material for High Density Heterogeneous Integration;kayaba;IEICE Tech Rep,2020
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