An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem-Reference-Cited by-同舟云学术

An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Noda Hiroto¹,Hiro Akito¹,Nishiguchi Naoki¹,Derakhshandeh Jabber²,Slabbekoorn John²,Beyne Eric²

Affiliation:

1. JSR Corporation,Yokkaichi,Japan

2. IMEC,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195814.pdf?arnumber=10195814

Reference5 articles.

1. Development of Polyimide Base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes

2. Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding

3. Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

4. Low temperature backside damascene processing on temporary carrier wafer targeting $7\ \mu\mathrm{m}$ and $5\ \mu\mathrm{m}$ pitch microbumps for N equal and greater than 2 die to wafer TCB stacking;derakhshandeh;IEEE Electronic Components and Technology Conference (ECTC),0

5. The 3-D Interconnect Technology Landscape

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