An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem
Author:
Affiliation:
1. JSR Corporation,Yokkaichi,Japan
2. IMEC,Leuven,Belgium
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195814.pdf?arnumber=10195814
Reference5 articles.
1. Development of Polyimide Base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes
2. Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
3. Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
4. Low temperature backside damascene processing on temporary carrier wafer targeting $7\ \mu\mathrm{m}$ and $5\ \mu\mathrm{m}$ pitch microbumps for N equal and greater than 2 die to wafer TCB stacking;derakhshandeh;IEEE Electronic Components and Technology Conference (ECTC),0
5. The 3-D Interconnect Technology Landscape
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