Author:
Derakhshandeh Jaber,Capuz Giovanni,Cherman Vladimir,Inoue Fumihiro,De Preter Inge,Hou Lin,Bex Pieter,Gerets Carine,Duval Fabrice,Webers Tomas,Bertheau Julien,Van Huylenbroeck Stefaan,Phommahaxay Alain,Shafahian Ehsan,Van der Plas Geert,Beyne Eric,Miller Andy,Beyer Gerald
Cited by
13 articles.
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1. 3D interconnects for quantum computing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Generating Test Patterns for Chiplet Interconnects: Achieving Optimal Effectiveness and Efficiency;2023 IEEE International Test Conference in Asia (ITC-Asia);2023-09-12
4. 微細バンプ接合による積層チップ間接続技術;Journal of The Japan Institute of Electronics Packaging;2023-05-01
5. Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4-μm Fine Pitch;IEEE Transactions on Electron Devices;2023-02