Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4-<i>μ</i>m Fine Pitch-Reference-Cited by-同舟云学术

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Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4-μm Fine Pitch

Published:2023-02 Issue:2 Volume:70 Page:683-688
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Shi Yunfan¹^ORCID,Wang Zilin¹^ORCID,Zhang Huawei²,Kang Jin³,Zheng Kai³,Bu Weihai³,Wang Zheyao⁴^ORCID

Affiliation:

1. School of Integrated Circuits, Tsinghua University, Beijing, China

2. CSMS, Wuxi, China

3. Semiconductor Technology Innovation Center (Beijing) Corporation, Beijing, China

4. School of Integrated Circuits and the Beijing Innovation Center for Future Chips, Tsinghua University, Beijing, China

Funder

National Natural Science Foundation of China

Semiconductor Technology Innovation Center (Beijing) Corporation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/10025571/09994662.pdf?arnumber=9994662

Reference35 articles.

1. Surface oxidation of liquid Sn

2. Reflow process optimization for micro-bumps applications in 3D technology

3. Void formation in Cu-Sn micro-connects

4. Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

5. Sn- and Cu-oxide reduction by formic acid and its application to power module soldering

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1. Intelligent Codesign Strategy for Thermal Management and Cost Control of 3-D Integrated System With TTSV;IEEE Transactions on Electron Devices;2023-10

2. Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO₂ Thin Films;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

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