Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO<sub>2</sub> Thin Films-Reference-Cited by-同舟云学术

Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO₂ Thin Films

Published:2023-09 Issue:9 Volume:13 Page:1502-1509
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Fang Zhen¹^ORCID,Zhang Jihua¹,Guo Yuhua²^ORCID,Gao Libin¹,Chen Hongwei¹,Liu Jinxu¹,Cai Xudong¹,Li Wenlei¹^ORCID,Guo Huan³

Affiliation:

1. School of Integrated Circuit Science and Engineering, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China

2. China Electronics Technology Group Corporation 38th Research Institute, Hefei, China

3. Chengdu Micro-Technology Company Ltd., Chengdu, China

Funder

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10287668/10233048.pdf?arnumber=10233048

Reference39 articles.

1. High Inductance Density Glass Embedded Inductors for 3-D Integration

2. Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication

3. Low temperature wafer bonding for MEMS processes and 3D integration

4. Impact of Ge Preamorphization Implantation on Both the Formation of Ultrathin TiSix and the Specific Contact Resistivity in TiSix/n-Si Contacts

5. Direct bonding of silicon nitride to copper via laser surface modification

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