High Inductance Density Glass Embedded Inductors for 3-D Integration-Reference-Cited by-同舟云学术

High Inductance Density Glass Embedded Inductors for 3-D Integration

Published:2023-06 Issue:6 Volume:33 Page:679-682
ISSN:2771-9588
Container-title:IEEE Microwave and Wireless Technology Letters
language:
Short-container-title:IEEE Microw. Wireless Tech. Lett.

Author:

Zhou Guanyu¹^ORCID,Gao Libin¹,Chen Yuzhe¹,Chen Hongwei¹,Li Wenlei¹^ORCID,Zhang Chao¹,Liu Jinxu¹,Zhang Jihua¹

Affiliation:

1. State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China

Funder

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/9944983/10144810/10061605.pdf?arnumber=10061605

Reference23 articles.

1. On-chip Spiral Inductors With Patterned Ground Shields For Si-based RF IC's

2. Glass Based 3D-IPD Integrated RF ASIC in WLCSP

3. Surface micromachined high-performance RF MEMS inductors

4. Design and Analysis of Vertical Nanoparticles-Magnetic-Cored Inductors for RF ICs

5. High performance IPDs (Integrated passive devices) and TGV (Through glass via) interposer technology using the photosensitive glass

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