Derivation and Analysis of a Hemispherical Physical Model and the Correction Factors for the Sidewall Roughness of Through-Glass Vias-Reference-Cited by-同舟云学术

Derivation and Analysis of a Hemispherical Physical Model and the Correction Factors for the Sidewall Roughness of Through-Glass Vias

Published:2023 Issue: Volume: Page:1-12
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Fang Zhen¹^ORCID,Zhang Jihua¹,Gao Libin¹,Li Shuqi¹,Liu Jinxu¹,Chen Hongwei¹,Yang Xiaolin²^ORCID,Li Wenlei¹^ORCID,Cai Xingzhou³,Cheng Yujian⁴^ORCID

Affiliation:

1. State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China

2. School of Physics, University of Electronic Science and Technology of China, Chengdu, China

3. Chengdu Micro-Technology Corporation, Ltd, Chengdu, China

4. School of Electronic Science and Engineering, EHF Key Laboratory of Fundamental Science, University of Electronic Science and Technology of China, Chengdu, China

Funder

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx7/22/4359079/10345699.pdf?arnumber=10345699

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