Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference29 articles.
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1. Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications;Journal of Materials Research and Technology;2023-11
2. A Review of Recent Research Trends of Forming of Metallic Bondlines Using Core-Shell Particles and Bonding Properties According to Particle Type;Korean Journal of Metals and Materials;2023-09-05
3. Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding;Journal of Materials Science;2023-06-26
4. Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging;Journal of Materials Science: Materials in Electronics;2023-03
5. Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4-μm Fine Pitch;IEEE Transactions on Electron Devices;2023-02
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