Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance
Author:
Affiliation:
1. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka, Japan
2. The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan
Funder
Osaka University
Advanced Low Carbon Technology Research and Development Program
China Scholarship Council
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.7b05308
Reference64 articles.
1. Direct Printing of Reduced Graphene Oxide on Planar or Highly Curved Surfaces with High Resolutions Using Electrohydrodynamics
2. Newly Designed Cu/Cu10Sn3 Core/Shell Nanoparticles for Liquid Phase-Photonic Sintered Copper Electrodes: Large-Area, Low-Cost Transparent Flexible Electronics
3. High-Resolution Printing of 3D Structures Using an Electrohydrodynamic Inkjet with Multiple Functional Inks
4. Toward 3D Printing of Pure Metals by Laser-Induced Forward Transfer
5. Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks
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