A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding-Reference-Cited by-同舟云学术

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A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Nakamura Yuzo¹,Tamura Kahori¹,Kayaba Yasuhisa¹,Okada Wataru¹,Shikama Takuo¹,Inada Satoshi¹

Affiliation:

1. Mitsui Chemicals, Inc.,Sodegaura,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195531.pdf?arnumber=10195531

Reference24 articles.

1. Process and Design Optimization for Hybrid Cu Bonding Void

2. Protective Layer for Collective Die to Wafer Hybrid Bonding

3. Die to Wafer Stacking with Low Temperature Hybrid Bonding

4. A Thin Adhesive for 3D/2.5D Si Chip Stacking at Low Temperature

5. Void-free BCB adhesive wafer bonding with high alignment accuracy

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bump-Less Interconnect with Room Temperature Pre-Bondable Adhesive and Solder for High Throughput Chip Stacking;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Surface Topography Control for Polymer/Cu Hybrid Bonding;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

3. State of the Art of Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

4. Cu-Cu Hybrid Bonding;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

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