An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique-Reference-Cited by-同舟云学术

An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Lyu Guang-Chao¹,Wang Hong-Guang¹,Zhou Min-Bo¹,Zhang Xin-Ping¹

Affiliation:

1. South China University of Technology,School of Materials Science and Engineering,Guangzhou,China,510640

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816720.pdf?arnumber=9816720

Reference25 articles.

1. Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

2. Modeling of viscoelastic effects on interfacial delamination in IC packages

3. Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

4. VCCT and integral concepts of bi-material interface fracture in low-k structures — Going to understand relation

5. Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

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1. An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10