Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique-Reference-Cited by-同舟云学术

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Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Lyu Guang-Chao¹,Zhou Min-Bo¹,Zhang Xin-Ping¹

Affiliation:

1. South China University of Technology,Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability, School of Materials Science & Engineering,Guangzhou,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873416.pdf?arnumber=9873416

Reference8 articles.

1. Mixed Mode Cracking in Layered Materials

2. Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

3. Virtual crack closure technique: History, approach, and applications

4. An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique

5. Cracks on bimaterial interfaces: elasticity and plasticity aspects

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