Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,Modeling and Simulation,Computational Mechanics
Link
http://link.springer.com/content/pdf/10.1007/s10704-009-9348-1.pdf
Reference37 articles.
1. Agrawal A, Karlsson AM (2006) Obtaining mode mixity for a bimaterial interface crack using the virtual crack closure technique. Int J Fract 141: 75–98
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3. Ayhan AO, Nied HF (2002) Stress intensity factors for three-dimensional surface cracks using enriched finite elements. Int J Numer Methods Eng 54: 899–921
4. Ayhan AO, Kaya AC, Nied HF (2006) Analysis of three-dimensional interface cracks using enriched finite elements. Int J Fract 142: 255–276
5. Bayram YB, Nied HF (2000) Enriched finite element—penalty function method for modeling interface cracks with contact. Eng Fract Mech 65: 541–557
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