An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners-Reference-Cited by-同舟云学术

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An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

Published:2023-12-05 Issue: Volume: Page:647-654
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Lyu Guang-Chao¹,Chen Bin¹,Zhang Xin-Ping¹,Zhou Min-Bo¹,Ke Chang-Bo¹,Mai Yiu-Wing²

Affiliation:

1. South China University of Technology,School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,Guangzhou,China,510640

2. The Hong Kong Polytechnic University,Department of Mechanical Engineering,Hong Kong

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457640.pdf?arnumber=10457640

Reference14 articles.

1. Stress Singularities Resulting From Various Boundary Conditions in Angular Corners of Plates in Extension

2. The stresses around a fault or crack in dissimilar media

3. Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface Tractions

4. The order of singularity at a multi-wedge corner of a composite plate

5. Numerical methods for the determination of multiple stress singularities and related stress intensity coefficients

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