Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package-Reference-Cited by-同舟云学术

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Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

Published:2021-09-14 Issue: Volume: Page:
ISSN:
Container-title:2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wang Hong-Guang,Zhou Min-Bo,Fei Jiu-Bin,Sun Li,Yang Bing-Xian,Hu Wei-Lin,Ke Chang-Bo,Zhang Xin-Ping

Funder

National Natural Science Foundation of China

Research Fund for the Guangzhou Municipal Science and Technology Program

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9567715/9567716/09568043.pdf?arnumber=9568043

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The crack propagation analysis in an IGBT package under in-service conditions by VCCT;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Moisture Desorption and Hygro-Vapor-Thermal Induced Interfacial Delamination in Underfilled FCBGA Package During Reflow Process;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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