Electrical characterization and modeling of 2-μm and 1.5-μm line-and-space high-density signal wiring in organic interposer
Author:
Affiliation:
1. IBM T. J. Watson Research Center,Yorktown Heights,NY,USA
2. IBM Research Tokyo,Shin-Kawasaki,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195407.pdf?arnumber=10195407
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3. Analysis on signal and power integrity of 2.3 d structure organic package;tsukamoto;International Symposium on Microelectronics,2019
4. Electrical Performances of Fan-Out Embedded Bridge
5. InFO_SoW (System-on-Wafer) for High Performance Computing
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