Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration-Reference-Cited by-同舟云学术

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Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration

Published:2024-05-28 Issue: Volume: Page:1098-1103
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Yang Sheng-Fan¹,Wang Wei-Chiao²,Lin Yi-Tzeng²,Hung Chih-Chiang²,Tung Hao-Yu³,Hsieh Justin⁴

Affiliation:

1. Global Unichip Corporation,System Simulation Div.,Hsin-Chu,Taiwan

2. Global Unichip Corporation,High Speed System Anal. Dept.,Hsin-Chu,Taiwan

3. Global Unichip Corporation,Memory Interface Dept.,Hsin-Chu,Taiwan

4. Operations Global Unichip Corporation,Hsin-Chu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565177.pdf?arnumber=10565177

Reference5 articles.

1. HBM3 Modules on Latest High Density Organic Laminate-Signal Integrity Design and Analysis with Interconnect Budget Results

2. Optimized Crosstalk and Impedance Design for HBM3 Channels in InFO

3. Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)

4. Electrical characterization and modeling of 2-μm and 1.5-μm line-and-space high-density signal wiring in organic interposer

5. Signal Integrity(SI) aware HBM2e/3 interposer design approach considering y-axis offset between logic and HBM die for HPC/AI/Network applications

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