HBM3 Modules on Latest High Density Organic Laminate-Signal Integrity Design and Analysis with Interconnect Budget Results-Reference-Cited by-同舟云学术

HBM3 Modules on Latest High Density Organic Laminate-Signal Integrity Design and Analysis with Interconnect Budget Results

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Libsch Frank R.¹,Mori Hiroyuki²

Affiliation:

1. IBM T.J. Watson Research Center,Yorktown Heights,NY,USA

2. IBM Research,Shin-Kawasaki,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195421.pdf?arnumber=10195421

Reference9 articles.

1. Electrical characterization and modeling of 2-?m and 1.5?m line-and-space high density signal wiring in organic interposer;watanabe;IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023,0

2. Signal and power integrity design and analysis for Bunch-of-Wires (BoW) interface for chiplet integration on advanced packaging;krishna;IEEE 73rd Electronic Components and Technology conference (ECTC),2023

3. New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D packaging employing next generation High Bandwidth Memory (HBM);kariyazaki;IEEE 2015 International 3D System Integration Conf,0

4. An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Signal, Power and Thermal Co-optimization Methodology for FPGA Advanced Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28