An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer-Reference-Cited by-同舟云学术

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An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Lee Chang-Chi,Hung Cp,Cheung Calvin,Yang Ping-Feng,Kao Chin-Li,Chen Dao-Long,Shih Meng-Kai,Chien Chien-Lin Chang,Hsiao Yu-Hsiang,Chen Li-Chieh,Su Michael,Alfano Michael,Siegel Joe,Din Julius,Black Bryan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545612.pdf?arnumber=7545612

Cited by 95 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. System technology co-optimization for advanced integration;Nature Reviews Electrical Engineering;2024-09-02

2. FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer;IEEE Transactions on Circuits and Systems I: Regular Papers;2024-09

3. Prospects and challenges of electrochemical random-access memory for deep-learning accelerators;Current Opinion in Solid State and Materials Science;2024-09

4. A Novel Switch Architecture for Multi-Die Optimization with Efficient Connections;Electronics;2024-08-13

5. Review of chiplet-based design: system architecture and interconnection;Science China Information Sciences;2024-07-19

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