Signal and Power Integrity Analysis on Integrated Fan-Out PoP (InFO_PoP) Technology for Next Generation Mobile Applications

Author:

Wang Chuei-Tang,Yu Douglas

Publisher

IEEE

Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Fan-out PoP Solder Joint Reliability Investigation by System Power Cycling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. High Density Automotive Module with Fan-Out Package;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15

3. Electrical characterization and modeling of 2-μm and 1.5-μm line-and-space high-density signal wiring in organic interposer;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. FOPOP Warpage Analysis for Package Design Optimization;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

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