Author:
You JinWei,Li Jay,Ho David,Li Jackson,Zhuang Ming Han,Lai David,Chung C. Key,Wang Yu-Po
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High Speed D2D Interface Applied on Advanced Package;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
3. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
4. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23
5. Electrical characterization and modeling of 2-μm and 1.5-μm line-and-space high-density signal wiring in organic interposer;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05