Author:
Thiele Matthias,Bigalke Steve,Lienig Jens
Cited by
4 articles.
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1. Reliability by Design: Avoiding Migration-Induced Failure in IC Interconnects;2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI);2022-08-22
2. Electromigration Analysis of VLSI Circuits Using the Finite Element Method;VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things;2019
3. The Pressing Need for Electromigration-Aware Physical Design;Proceedings of the 2018 International Symposium on Physical Design;2018-03-25
4. Fundamentals of Electromigration;Fundamentals of Electromigration-Aware Integrated Circuit Design;2018