The Pressing Need for Electromigration-Aware Physical Design-Reference-Cited by-同舟云学术

The Pressing Need for Electromigration-Aware Physical Design

Published:2018-03-25 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2018 International Symposium on Physical Design
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Author:

Lienig Jens¹,Thiele Matthias¹

Affiliation:

1. Dresden University of Technology, Dresden, Germany

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3177540.3177560

Reference29 articles.

1. Int. Technology Roadmap for Semiconductors 2.0 (ITRS) 2015 Edition http://www.itrs2.net/itrs-reports.html Int. Technology Roadmap for Semiconductors 2.0 (ITRS) 2015 Edition http://www.itrs2.net/itrs-reports.html

2. Size-dependent resistivity of metallic wires in the mesoscopic range

3. X. Yu K. Weide "A study of the thermal-electrical- and mechanical influence on degradation in an aluminum-pad structure " Microelectronics and Reliability (1997) 37 1545--1548. X. Yu K. Weide "A study of the thermal-electrical- and mechanical influence on degradation in an aluminum-pad structure " Microelectronics and Reliability (1997) 37 1545--1548.

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