Reliability by Design: Avoiding Migration-Induced Failure in IC Interconnects-Reference-Cited by-同舟云学术

Reliability by Design: Avoiding Migration-Induced Failure in IC Interconnects

Published:2022-08-22 Issue: Volume: Page:
ISSN:
Container-title:2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI)
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Author:

Rothe Susann¹,Lienig Jens¹

Affiliation:

1. Dresden University of Technology, Institute of Electromechanical and Electronic Design (IFTE),Dresden,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9893151/9893215/09893237.pdf?arnumber=9893237

Reference37 articles.

1. Electromigration Inside Logic Cells

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4. Compact modeling and spice-based simulation for electrothermal analysis of multilevel ulsi interconnects;chiang;IEEE/ACM International Conference on Computer Aided Design ICCAD 2001 IEEE/ACM Digest of Technical Papers,0

5. FLUTE-EM: Electromigration-Optimized Net Topology Considering Currents and Mechanical Stress

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1. Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices;Electronics;2023-10-25

2. A Comparative Study and Analysis of Various Interconnects for Very Large-Scale Integration;ECS Advances;2023-09-01

3. Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26