Electrical characteristics, stability, electromigration, Joule heating, and reliability aspect of focused ion beam fabricated gold and copper nanobar interconnects on SiO2 and glass substrates

Author:

Singh Abhishek Kumar12,Kumar Jitendra13

Affiliation:

1. Indian Institute of Technology Kanpur, Materials Science Program, Kanpur 208016, India

2. Department of Physics, Darbhanga College of Engineering, Mabbi, P.O. Lal Sahpur, Darbhanga-846005, Bihar, India

3. 654 Race Course Valley, Dehradun 248001, Uttarakhand, India

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Reliability by Design: Avoiding Migration-Induced Failure in IC Interconnects;2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI);2022-08-22

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