Author:
Posser Gracieli,Sapatnekar Sachin S.,Reis Ricardo
Publisher
Springer International Publishing
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26
2. Reliability by Design: Avoiding Migration-Induced Failure in IC Interconnects;2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI);2022-08-22
3. Reliability Challenges in FinFETs;Mitigating Process Variability and Soft Errors at Circuit-Level for FinFETs;2021
4. Challenges in the Design of Integrated Systems for IoT;IFIP Advances in Information and Communication Technology;2020
5. Strategies for Reducing Power Consumption and Increasing Reliability in IoT;IFIP Advances in Information and Communication Technology;2019