Analysis of the 1st and 3rd Quadrant Transients of Symmetrical and Asymmetrical Double-Trench SiC Power MOSFETs
Author:
Funder
U.K. Supergen ORE Hub
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Medicine
Link
http://xplorestaging.ieee.org/ielx7/8782709/9343742/09400715.pdf?arnumber=9400715
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. TCAD Analysis of Single-Event Burnout Hardness for an Improved CoolSiC Trench MOSFET;IEEE Transactions on Electron Devices;2024-08
2. Impact of SiC power MOSFET interface trap charges on UIS reliability under single pulse;Microelectronics Reliability;2024-04
3. High-Energy Dynamic Avalanche to Failure by Incremental Source-Voltage Increase in Symmetric Double-Trench & Asymmetric Trench SiC MOSFETs;IEEE Open Journal of Industry Applications;2024
4. Enhancing Performance of Dual-Gate FinFET with High-K Gate Dielectric Materials in 5 nm Technology: A Simulation Study;Transactions on Electrical and Electronic Materials;2023-10-04
5. Investigation on Performance for Silicon and GaAs Channel of Double-Gate MOSFETs;Lecture Notes in Electrical Engineering;2023-09-03
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