High Thermal Conductivity Insulators for Thermal Management in 3D Integrated Circuits-Reference-Cited by-同舟云学术

High Thermal Conductivity Insulators for Thermal Management in 3D Integrated Circuits

Published:2023-03 Issue:3 Volume:44 Page:496-499
ISSN:0741-3106
Container-title:IEEE Electron Device Letters
language:
Short-container-title:IEEE Electron Device Lett.

Author:

Köroğlu Çağil¹^ORCID,Pop Eric²^ORCID

Affiliation:

1. Department of Electrical Engineering, Stanford University, Stanford, CA, USA

2. Department of Electrical Engineering, the Department of Materials Science and Engineering, Precourt Institute for Energy, Stanford University, Stanford, CA, USA

Funder

Stanford SystemX Alliance

Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/55/10053585/10029348.pdf?arnumber=10029348

Reference38 articles.

1. A study of scaling effects on DRAM reliability

2. Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and Challenges

3. Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs

4. Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation

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