Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7147632/7152139/07152174.pdf?arnumber=7152174
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High Thermal Conductivity Insulators for Thermal Management in 3D Integrated Circuits;IEEE Electron Device Letters;2023-03
2. Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03
3. Multivariate Adaptive Regression Splines in Standard Cell Characterization for Nanometer Technology in Semiconductor;Topics in Splines and Applications;2018-06-06
4. Electrical and photonic off-chip interconnection and system integration;Optical Interconnects for Data Centers;2017
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