Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and Challenges-Reference-Cited by-同舟云学术

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Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and Challenges

Published:2019 Issue: Volume:7 Page:878-887
ISSN:2168-6734
Container-title:IEEE Journal of the Electron Devices Society
language:
Short-container-title:IEEE J. Electron Devices Soc.

Author:

Jiang Junkai,Parto Kamyar^ORCID,Cao Wei^ORCID,Banerjee Kaustav^ORCID

Funder

UC Multicampus Research Programs and Initiatives (MRPI) Research Program

Core Research for Evolutional Science and Technology

Army Research Office

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Biotechnology

Link

http://xplorestaging.ieee.org/ielx7/6245494/8656606/08746192.pdf?arnumber=8746192

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4. Improvement of Contact Resistance and 3D Integration of 2D Material Field‐Effect Transistors Using Semi‐Metallic PtSe₂ Contacts;Advanced Functional Materials;2024-08-02

5. Van der Waals polarity-engineered 3D integration of 2D complementary logic;Nature;2024-05-29

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