Void Formation Study of Flip Chip in Package Using No-Flow Underfill-Reference-Cited by-同舟云学术

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Void Formation Study of Flip Chip in Package Using No-Flow Underfill

Published:2008-10 Issue:4 Volume:31 Page:297-305
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Lee Sangil,Yim Myung Jin,Master Raj N.,Wong C. P.,Baldwin Daniel F.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4634590/04634594.pdf?arnumber=4634594

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Dispensing Type on Void Formation Using Convolutional Neural Network;Journal of Electronic Packaging;2024-08-09

2. Prediction of the void formation in no-flow underfill process using machine learning-based algorithm;Microelectronics Reliability;2022-08

3. Underfill Flow in Flip-Chip Encapsulation Process: A Review;Journal of Electronic Packaging;2021-08-06

4. Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages;3D Microelectronic Packaging;2020-11-24

5. Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic analysis;Journal of Applied Polymer Science;2018-05-06

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