Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages
Publisher
Springer Singapore
Reference84 articles.
1. S. Lee, Fundamental study of underfill void formation in flip chip assembly (2009)
2. S. Lee, R. Master, D.F. Baldwin, Assembly Yields Characterization of High I/O Density, Fine Pitch Flip Chip in Package using No-Flow Underfill (Electronic Components and Technology Conference, 2007), p. 35
3. S. Lee, R. Master, D.F. Baldwin, Assembly yields characterization and failure analysis of flip chip in package using no-flow underfill. Int. Wafer Level Packag. Cong. 169–175 (2007)
4. S. Lee, R. Master, D.F. Baldwin, Void Formation Study of High I/O Density, Fine Pitch Flip Chip in Package Using No-Flow Underfill (Surface Mount Technology Association International, 2007), pp. 525–530
5. S. Lee et al., Void formation study of flip chip in package using no-flow underfill. IEEE Trans. Electron. Packag. Manuf. 31(4), 297–305 (2008)