Prediction of the void formation in no-flow underfill process using machine learning-based algorithm

Author:

Nashrudin Muhammad Naqib,Ng Fei Chong,Abas Aizat,Abdullah Mohd. Zulkifly,Ali Mohd. Yusuf Tura,Samsudin Zambri

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference37 articles.

1. Void formation study of flip chip in package using no-flow underfill;Lee,2008

2. No-flow underfill: effect of chip placement speed on the void formation using numerical method;Nashrudin;Microelectron. J.,2021

3. F. C. Ng and M. A. Abas, “Underfill flow in flip-chip encapsulation process: a review,” J. Electron. Packag., Mar. 2021, doi:https://doi.org/10.1115/1.4050697.

4. Regional segregation with spatial considerations based analytical filling time model for non-Newtonian power-law underfill fluid in flip-chip encapsulation;Ng;J. Electron. Packag.,2019

5. Spatial analysis of underfill flow in flip-chip encapsulation;Ng;Solder. Surf. Mt. Technol.,2020

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1. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning;Journal of Electronic Packaging;2024-04-05

3. Deep learning and analytical study of void regional formation in flip-chip underfilling process;Soldering & Surface Mount Technology;2023-10-24

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