Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic analysis-Reference-Cited by-同舟云学术

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Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic analysis

Published:2018-05-06 Issue:33 Volume:135 Page:46639
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Jang Keon-Soo¹^ORCID,Eom Yong-Sung¹,Choi Kwang-Seong¹,Bae Hyun-Cheol¹

Affiliation:

1. ICT Materials and Components Research Laboratory; Electronics and Telecommunications Research Institute (ETRI); Daejeon 34129 South Korea

Funder

Nano-Convergence Foundation

Ministry of Science, ICT and Future Planning (MSIP, Korea)

Ministry of Trade, Industry and Energy (MOTIE, Korea)

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference32 articles.

1. Solid Logic Technology: Versatile, High-Performance Microelectronics

2. Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

3. Life-time estimation of high-power blue light-emitting diode chips

4. Dal , S. L. B. Zamora , N. T. 2005 508

5. Adhesion characteristics of underfill resins with flip chip package components

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