Author:
Lau John H.,Yue Tang Gong
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Fabrication and characterization of robust through-silicon vias for silicon-carrier applications;Andry;IBM J Res Dev,2008
2. Knickerbocker JU, Andry PS, Dang B, Horton RR, Patel CS, Polastre RJ, et al. 3-D silicon integration. In: IEEE proceedings of electronic components and technology conf; May 2008. p. 538–43.
3. Kumagai K, Yoneda Y, Izumino H, Shimojo H, Sunohara M, Kurihara T. A silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnection. In: IEEE proceedings of electronic components and technology conf, Orlando, FL; May 2008. p. 571–6.
4. Sunohara M, Tokunaga T, Kurihara T, Higashi M. Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring. In: IEEE proceedings of electronic components and technology conf, Orlando, FL; May 2008. p. 847–52.
5. Lee HS, Choi Y-S, Song E, Choi K, Cho T, Kang S. Power delivery network design for 3D SIP integrated over silicon interposer platform. In: IEEE proceedings of electronic components and technology conf, Reno, NV; May 2007. p. 1193–8.
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