Affiliation:
1. School of Computer Science, Northwestern Polytechnical University, Xi’an, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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1. Crosstalk and Power Analysis in Tapered based Composite Cu-CNT TSV in 3D IC;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19