Crosstalk and Power Analysis in Tapered based Composite Cu-CNT TSV in 3D IC
Author:
Affiliation:
1. International Institute of Information Technology,Department of Electronics and Communication Engineering,Naya Raipur,Chhattisgarh,India,493661
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10557746/10557828/10558624.pdf?arnumber=10558624
Reference20 articles.
1. A High-efficiency Design Method of TSV Array for Thermal Management of 3D Integrated System
2. The Investigation of Electrical Characteristics for Carbon Nano-Tubes as Through Silicon Via in Multi-Layer Stacking Scheme With an Optimized Structure
3. Study of Electromigration-Induced Void Nucleation Problem Dominated by Bulk, Grain Boundary, and Interfacial Diffusion Based on an Improved Energy Approach
4. Role of Cu/SiO2 Rough Interface in TSV for High-Power Device Under Electromigration
5. Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits
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