Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits
Author:
Affiliation:
1. School of Electronics and Information, Guangdong Polytechnic Normal University, Guangzhou, China
2. School of Electronics Information and Electrics Engineering, Xiangnan University, Chenzhou, China
Funder
Guangzhou Basic Research Program
Scientific Research Startup Project of Guangdong Polytechnic Normal University
Chenzhou City Science and Technology Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/6287639/10005208/10188918.pdf?arnumber=10188918
Reference34 articles.
1. The specific heat and effective thermal conductivity of composites containing single-wall and multi-wall carbon nanotubes
2. Electromigration performance of Through Silicon Via (TSV) – A modeling approach
3. Experimental investigation of heat transfer in pin-fins heat sinks for cooling applications
4. On the Applicability of Single-Walled Carbon Nanotubes as VLSI Interconnects
5. Study of Crosstalk Effect on the Propagation Characteristics of Coupled MLGNR Interconnects
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1. The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance;Case Studies in Thermal Engineering;2024-06
2. Crosstalk and Power Analysis in Tapered based Composite Cu-CNT TSV in 3D IC;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19
3. Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips;IEICE Electronics Express;2024
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