Funder
Guangdong Polytechnic Normal University
Guangdong Provincial Natural Science Foundation
Guangzhou Municipal Science and Technology Bureau
Reference54 articles.
1. Oxidation resistive, CMOS compatible copper-based alloy ultrathin films as a superior passivation mechanism for achieving 150 °C Cu–Cu wafer on wafer thermocompression bonding;Panigrahi;IEEE Trans. Electron. Dev.,2017
2. Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation;Rakesh;Mater. Today Proc.,2020
3. Minimization of electrical signal interference with appropriate core material for 3D IC at THz applications;Tallapalli;Trans. Electr. Electron. Mater.,2023
4. Improvement in thermal issue by using suitable dielectric material and core for future IC integration applications;Venkata Meghana,2023
5. Design and performance analysis of 3D IC integration model for high frequency and RF applications;Manasa,2023