Adhesion characteristics of underfill resins with flip chip package components
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference23 articles.
1. Measurements of solder bump lifetime as a function of underfill material properties
2. Adhesion of underfill and components in flip chip encapsulation
3. Encapsulant materials systems for flip‐chip‐on‐board assemblies: addressing manufacturing issues
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1. Thermal Aging Induced Underfill Degradation and Its Effect on Reliability of Advanced Packaging;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
2. Solderability Using Thermoset Resin-Based Solder Pastes Covered with Thermoplastic Resin Film;MATERIALS TRANSACTIONS;2018-08-01
3. Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic analysis;Journal of Applied Polymer Science;2018-05-06
4. Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles;MATERIALS TRANSACTIONS;2013
5. Interfacial Adhesion in Polymer Systems;Interfacial Compatibility in Microelectronics;2012
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