Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations
Author:
Affiliation:
1. Imec,Leuven,Belgium
2. Insidix,Seyssins,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100821.pdf?arnumber=10100821
Reference12 articles.
1. Warpage measurements to support the development of mmWave modules
2. Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles
3. State dependent characterization and modelling of fast curing moulding compounds
4. Comparison of advanced package warpage measurement metrologies
5. Warpage of Plastic IC Packages as a Function of Processing Conditions
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal Resistance Modeling to Analyze and Simulate of Quad Flat No-Leads Packaging on Printed Circuit Board by Using ANSYS;2024 IEEE 7th International Electrical and Energy Conference (CIEEC);2024-05-10
2. Towards measurements of global coefficient of thermal expansion of QFN;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Effect of potting on the solder joint reliability of QFN packages under thermal cycling load;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
4. Thermal Analysis and Simulation of Quad Flat No-Leads Packaging on Printed Circuit Board with ANSYS;2023 IEEE 7th Conference on Energy Internet and Energy System Integration (EI2);2023-12-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3