Warpage measurements to support the development of mmWave modules-Reference-Cited by-同舟云学术

Warpage measurements to support the development of mmWave modules

Published:2022-11 Issue: Volume:138 Page:114731
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Albrecht Oliver,Meier Karsten,Schaulin Michael,Toussaint Pierre-Louis,Gamba Baptiste,Cruz Rodolfo,Vernhes Pierre,Götze Christian,Bock Karlheinz

Funder

Deutsche Forschungsgemeinschaft

Technische Universität Dresden

Center for Evolutionary and Theoretical Immunology

European Commission

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

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4. JEDEC SPP-024 , Issue A: Reflow Flatness Requirements for Ball Grid Array Packages, JEDEC Publication No. 95, page 3.24-1.

5. Package Warpage Measurement of Surface-mount Integrated Circuits at Elevated Temperature,2009

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