Effect of potting on the solder joint reliability of QFN packages under thermal cycling load

Author:

Nawghane Chinmay1,Vandevelde Bart1,Vanderstraeten Daniel2,Haspeslagh Harold3,Nauwelaerts Thomas3

Affiliation:

1. Imec,Leuven,Belgium

2. Onsemi,Oudenaarde,Belgium

3. NiniX Technologies,Brugge,Belgium

Funder

European Commission

Publisher

IEEE

Reference11 articles.

1. Effect of encapsulation materials on tensile stress during thermo-mechanical cycling of Pb-free solder joints;Serebreni;IPC APEX,2017

2. Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects;Du

3. Modelling the Influence of Coatings, Potting and Underfills on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages;Hillman

4. Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications

5. Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations

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