Effect of potting on the solder joint reliability of QFN packages under thermal cycling load
Author:
Affiliation:
1. Imec,Leuven,Belgium
2. Onsemi,Oudenaarde,Belgium
3. NiniX Technologies,Brugge,Belgium
Funder
European Commission
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491410.pdf?arnumber=10491410
Reference11 articles.
1. Effect of encapsulation materials on tensile stress during thermo-mechanical cycling of Pb-free solder joints;Serebreni;IPC APEX,2017
2. Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects;Du
3. Modelling the Influence of Coatings, Potting and Underfills on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages;Hillman
4. Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications
5. Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations
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