Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications-Reference-Cited by-同舟云学术

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Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications

Published:2019-11 Issue:11 Volume:9 Page:2210-2218
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yin Chunyan^ORCID,Stoyanov Stoyan^ORCID,Bailey Chris^ORCID,Stewart Paul

Funder

Defense Microelectronics Activity (DMEA), USA, through the Reliability Prediction Analysis for Solder Joint Integrity Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/8894901/08752031.pdf?arnumber=8752031

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of a Conformal Coating on the Signal Integrity of Space Electronics Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-11

2. The Effect of Acrylic Conformal Coating in the Reliability of Solder Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-04

3. Prediction of Solder Joint Reliability with Applied Acrylic Conformal Coating;Journal of Electronic Materials;2021-10-07

4. Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15

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