Comparison of advanced package warpage measurement metrologies-Reference-Cited by-同舟云学术

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Comparison of advanced package warpage measurement metrologies

Published:2016-09 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference
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Author:

Kultcrman Ron W.,Loh Wei Keat,Fu Haley,Tsuriya Masahiro

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7746813/7761905/07761959.pdf?arnumber=7761959

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding;Materials;2024-07-22

2. Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions;Applied Sciences;2023-11-08

3. Addressing sub-micron thermal warpage: Industrial application on semiconductor devices;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

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