Comparative Analysis of Flow Capability of Epoxy Molding Compound between Spiral Structure and Actual Mold by Mold Flow Simulation
Author:
Affiliation:
1. Chinese Academy of Science,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055
Funder
National Natural Science Foundation of China
Youth Innovation Promotion Association
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873387.pdf?arnumber=9873387
Reference9 articles.
1. Warpage of Compression Molded SiP Strips
2. Modeling of Molded Electronic Package Warpage Characteristic with Cure Induced Shrinkage and Viscoelasticity Properties
3. Mold Flow Analysis of a SiP Package for Power Management
4. Package with simulation method to predict underfill flow pattern with different dispensed condition
5. A novel model for simulating the racing effect in capillary-driven underfill process in flip chip
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