A novel model for simulating the racing effect in capillary-driven underfill process in flip chip-Reference-Cited by-同舟云学术

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A novel model for simulating the racing effect in capillary-driven underfill process in flip chip

Published:2018-02-09 Issue:4 Volume:28 Page:045002
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Zhu Wenhui,Wang Kanglun,Wang Yan^ORCID

Funder

China Postdoctoral Science Foundation

National Basic Research Program

Discovery Project of State Key Laboratory of High Performance Complex Manufacturing

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://iopscience.iop.org/article/10.1088/1361-6439/aaa2e4/pdf

Reference24 articles.

1. Flip the Chip

2. Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

3. Recent advances in modeling the underfill process in flip-chip packaging

4. Externally guided underfill encapsulation and subsequent filler particle migration during electronics packaging

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration;Micromachines;2023-09-30

2. Underfill Flow Numerical Simulation for Achieving Board Level Low Cost and High Reliability of Mobile Devices;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Two-Phase Flow Simulation of Capillary Underfilling as a Design Tool for Heterogenous Integration;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

4. Comparative Analysis of Flow Capability of Epoxy Molding Compound between Spiral Structure and Actual Mold by Mold Flow Simulation;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. Capillary Flow Analysis of Underfill in Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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